Taipei, Taiwan, 20 September, 2000 - VIA Technologies, Inc. today announced the launch of the VIA Apollo Pro266 and VIA Apollo KT266 chipsets, enabling the industry-wide adoption of Double Data Rate (DDR266) DRAM as the next generation memory standard for high-performance server, workstation, and PC applications on the Intel? Socket 370 and AMD Socket A processor platforms.
With their support for DDR266 DRAM, the VIA Apollo Pro266 and VIA Apollo KT266 provide the headroom necessary to deliver optimum system performance by doubling memory data throughput and reaching a peak memory bandwidth of 2.1GB per second. To ensure balanced overall system performance, the chipsets also come with a host of other leading-edge features, including a 133MHz Front Side Bus, AGP4X, ATA-100 support, and a new high-speed low-latency V-Link bus that doubles the communication bandwidth between the North and South Bridge to 266MB per second.
"With the launch of the VIA Apollo Pro266 and VIA Apollo KT266, VIA is enabling a rapid industry-wide transition to DDR memory on both the leading processor platforms," commented Wen Chi Chen, President and CEO of VIA. "DDR provides the most appropriate memory solution for solving the system performance bottleneck while leveraging the cost benefits of the existing SDRAM infrastructure."
VIA Apollo KT266
Combining support for high-speed DDR266 DRAM with an ultra-fast Front Side Bus, AGP4X, and ATA-100 support, the VIA Apollo KT266 delivers a new level of performance for AMD Athlon? processor based systems. Other features include the new high-speed V-Link bus, as integrated six channel advanced audio, six USB ports, LPC bus, and integrated 10/100Mbps Ethernet and Home PNA.
Pricing & Availability
The VIA Apollo Pro266 and the VIA Apollo KT266 are manufactured at TSMC in a .22 micron, 3 metal layer process, and are priced at $40 in OEM quantities. Product photographs and product backgrounders are available upon request. Please contact VIA for more information. Motherboards featuring the VIA Apollo Pro266 will be on display at the forthcoming VIA Technology Forum in Taipei on 20-21 September.