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VIA Eden Platform Powers New HP Thin Clients
Date: Tuesday June 07, 2005
Category: 3DNow!
Manufacturer Link: VIA
Proven ultra-low power VIA Eden(TM) processor selected by HP for new range of space-saving thin clients

VIA Eden Platform Powers New HP Thin Clients

Proven ultra-low power VIA Eden(TM) processor selected by HP for new range of space-saving thin clients

Taipei, Taiwan, 7 June 2005 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced that the high-performance, energy-efficient VIA Eden(TM) Platform will be integrated into the new HP Compaq t5125, t5520 and t5525 thin clients. Bringing enhanced levels of performance, reliability and functionality to the corporate environment, this design win further strengthens VIA's leadership in this fast-emerging market segment.

Providing businesses with greater manageability, scalability, security and flexibility, thin clients offer a holistic cost-effective approach to corporate productivity with a network-based computing model. The new HP Compaq t5125, t5520 and t5525 fine-tune the concept with a range of smart, small footprint designs, capable of meeting the demands of the corporate environment with the high-performance, ultra-low power of VIA Eden processors.

"We are delighted that HP has adopted the VIA Eden Platform for their new range of thin client products, strengthening our presence in this rapidly growing market," commented Richard Brown, Vice President of Marketing, VIA Technologies, Inc. "These new thin clients leverage our unique combination of power efficiency, performance and security."

The new range of HP Compaq thin clients feature the highly energy-efficient VIA Eden ESP processor with ultra-low thermal profile, enabling higher performance in a small form factor and fanless design, and feature 128MB RAM and up to 256MB Compact Flash that offers enough storage memory for most current firmware and future updates and upgrades.

"By using the VIA Eden Platform, our thin clients are using lower power for key components which will provide our customers with the lifecycles and return on investment they expect from HP," said Greg Schmidt, Product Marketing Manager, Thin Client Marketing, Imaging and Personal Systems Group, HP. "Additionally, VIA's high-performance, low-power design allows for a smaller footprint. This is a big bonus to a traditional desktop customer wishing to capitalize on the security and manageability of thin client computing in a small, reliable, and cost efficient client."

The new thin clients are expected to be available mid-June 2005.

About the VIA Eden Platform

The VIA Eden Platform is based on the ultra-low power native x86 VIA Eden ESP processor and a choice of highly integrated and power efficient VIA chipsets and companion chips. Available at speeds ranging from 300MHz to 1GHz and featuring the lead-free EBGA package that helps reduce thermal density, VIA Eden ESP processors measure a mere 35mm x 35mm x 1.5mm, making them suitable for consumer electronics, industrial and commercial devices that require compatibility with PC hardware and software. With Thermal Design Power (TDP) values ranging from 2.5W to a maximum of 7W when running at 1GHz, the VIA Eden ESP processor boasts industry-leading low power consumption from a fanless native x86 processor.

For more information on the VIA Eden ESP processor, please visit the VIA Eden ESP processor website at:

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs, motherboard vendors and system

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